The Taiwan Semiconductor Manufacturing Company, better known as TSMC, is holding its 24th annual Technology Symposium in Santa Clara right now, and it’s just unveiled a process that could spell a revolution for graphics cards: Wafer-on-Wafer (WoW) technology. As the name suggests, WoW works by stacking layers vertically rather than placing them horizontally across a board, much like how 3D NAND flash memory is stacked in modern solid-state drives. What this means is more powerful GPUs for Nvidia and AMD without the need to increase their physical size or shrink the fabrication process. The back-to-back wafers make contact with each other through the use of 10-micron holes that form a through-silicon via (TSV) connection. TSMC partner Cadence explains that WoW designs can be placed onto an interposer—an electrical interface that routes one connection to another—creating a 2-die cube. It’s even possible to vertically stack more than two wafers using the WoW … [Read more...] about TSMC’s stacked wafer tech could double the power of Nvidia and AMD GPUs
Semiconductor wafer fabrication process
A new diamond semiconductor circuit could make power conversion systems more efficient, reducing wasted power. Researchers from Japan's National Institute for Materials Science have fabricated a key circuit in power conversion systems using hydrogenated diamond that can function at temperatures as high as 300 degrees Celsius. Power generators such as windmills and solar panels transfer electricity to buildings and the power grid, but lose nearly 10 percent of the generated power. The new circuits can be used in diamond-based electronic devices that are smaller, lighter and more efficient than their silicon-based counterparts are. “For the high-power generators, diamond is more suitable for fabricating power conversion systems with a small size and low power loss,” Jiangwei Liu, a researcher at Japan's National Institute for Materials Science and a co-author on the paper, said in a statement. Due to the limitation of material physical properties, silicon-based electronic … [Read more...] about Diamond Enables Circuits to Take More Heat
Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separate substrate is coated with a resist. Like a stamping process, the patterned template is pressed against the substrate, forming a pattern on the substrate at feature sizes down to 5nm and beyond. Fig. 1: Nanoimprint process vs. traditional optical lithography. Source: Canon Nanoimprint is a cost-effective, single-exposure technique that doesn’t require expensive optics and multiple patterning. But the technology has some issues in terms of defectivity, overlay and throughput, preventing it from becoming a more mainstream lithographic technology. Today, NIL is mainly used for non-semiconductor … [Read more...] about What Happened To Nanoimprint Litho?
Beijing NAURA Microelectronics Equipment Co.,Ltd. (“NAURA”) and Akrion Systems LLC today jointly announced that the previously announced acquisition by NAURA has been completed. As a result of the closing of the transaction, NAURA Akrion Inc. (“NAURA Akrion”), a wholly owned subsidiary of NAURA in the United States, acquired Akrion’s surface preparation business.“We are very pleased to have completed the transaction,” said Mr. Michael Ioannou, NAURA Akrion CEO. “Enhanced by the strong strategic and financial support of our new investors, the company’s future is brighter than ever. We are excited to continue building and growing NAURA Akrion into a global leader in wet-processing systems as part of NAURA.”“The successful completion of the transaction will enhance NAURA’s cleaning equipment product line rapidly, and allow it to cover the integrated circuit chip process including Pre Film Deposition Clean, PR Strip, … [Read more...] about NAURA Akrion Inc. acquired Akrion’s surface preparation business
Multibeam Corporation today disclosed a new patent that describes the innovative use of e-beam technology for highly localized precision etching in manufacturing advanced memory and logic ICs. The vast improvement enabled by the new patent highlights the company’s leadership in innovating a high-throughput e-beam platform to enhance the industry’s fabrication capability.Multibeam’s dynamic e-beam platform concurrently addresses four major applications: Complementary E-Beam Lithography (CEBL) to reduce litho cost; Direct Electron Writing (DEW) to enhance device security; Direct Deposition/Etch (DDE) for highly localized precision etch and deposition using directed electron activation; and E-Beam Inspection (EBI) to speed defect detection and yield ramp.The new patent describes innovative techniques utilizing electrons to enhance selective removal of material from the substrate at precise locations. The techniques are especially useful for advanced-IC fabrication.The … [Read more...] about New Multibeam patent enhances highly-localized precision material removal