posted on 11 Mar 2016, 07:32 18 1. nebula (Posts: 1009; Member since: 20 Feb 2015) ISOCELL seems to have a slightly warmer image reproduction and a tad a very tad brighter. posted on 11 Mar 2016, 08:30 1 14. Arch_Fiend (Posts: 3781; Member since: 03 Oct 2015) I agree. posted on 11 Mar 2016, 09:34 6 22. uggman (Posts: 57; Member since: 01 Feb 2013) As a photography amateur both sensor look fine in detail abd exposure, the samsung sensor got a little yellowish greenish hue to its images, the exposure on the sony sensor its just a hair under, still both sensors look great and take exelent pictures which it will be just fine for most or the mayority of people. posted on 11 Mar 2016, 10:09 2 24. marorun (Posts: 5029; Member since: 30 Mar 2015) Its also seem to have a bit less detail. posted on 11 Mar 2016, 14:05 3 33. vincelongman (Posts: 5283; Member since: 10 Feb 2013) It would be interesting to see a comparison of 5x IMX260s or 5x ISOCELLs … [Read more...] about Comments for : Spot the S7 edge version differences: Sony IMX260 vs Samsung ISOCELL camera sensor samples
By Dr. Phil Garrou, Contributing EditorContinuing our look at the 14th annual 3DASIP Conference. K&STom Strothmann of K&S discussed the requirements for HBM Memory Stacking. High Bandwidth Memory (HBM 1,2) are currently assembled using C2W compression bonding. Production is mostly done by memory suppliers as opposed to OSATS. HBM 3 is projected for 2019.There are two prominent stacked die process flows:TC-CUF (Thermocompression with Capillary Underfill)Die by die stacked using TCBDie stack tacked followed by mass reflowTC-NCF (Thermocompression with Non-Conductive Film)Stacked die by die using TCBDie stack tacked followed by Collective BondDie stack tacked followed by Gang BondCost reduction has focused on units/hr for the TCB process:Bondhead temperature ramp speedTarget and die material handling systemsNumber of bondheads and accuracy requirementsTacking has the potential to move machine UPH from 1700 to 3500 for a 4 die stacked process using NCF if a separate gang … [Read more...] about IFTLE 370 3D-ASIP Part 3: Bonding and Assembly in HBM Memory Stacks
By Dr. Phil Garrou, Contributing Editor Consolidation in CIS MarketRemembering our IFTLE rule [ see IFTLE 241, “Simply Obeying the Laws of Economics”] that maturing markets have 3 players with > 85% of market share, we note that Gartner Assoc. has reported that the top 5 vendors accounted for 88.9% of global CIS revenue in 2016 and the top 3 companies have 78.9% of the market, up from 77.1% in 2015 so we are getting close… [link] Teledyne / DALSAInvensas (Experi) has announced technology transfer of its Direct Bond Interconnect (DBI) to Teledyne DALSA. This capability enables Teledyne DALSA to deliver next-generation image sensors to customers in the automotive, IoT and consumer electronics markets. Invensas and Teledyne DALSA announced the signing of a development license in February 2017. All of the major image sensor players appear to be adopting this image sensor stacking technology. Chip Stacking for Image SensorsRay Fontaine at TechInsights … [Read more...] about IFTLE 367 CIS Consolidation; DARPA CHIPS Headlines 14th 3D-ASIP Conf.
A discovery by an international team of researchers from Princeton University, the Georgia Institute of Technology and Humboldt University in Berlin points the way to more widespread use of an advanced technology generally known as organic electronics.The research, published in the journal Nature Materials, focused on organic semiconductors, a class of materials prized for their applications in emerging technologies such as flexible electronics, solar energy conversion, and high-quality color displays for smartphones and televisions. In the short term, the advancement could particularly help with organic light-emitting diodes that operate at high energy to emit colors such as green and blue.“Organic semiconductors are ideal materials for the fabrication of mechanically flexible devices with energy-saving, low-temperature processes,” said Xin Lin, a doctoral student and a member of the Princeton research team. “One of their major disadvantages has been their … [Read more...] about Advancing the path to organic electronics beyond cell phone screens
By Dr. Phil Garrou, Contributing Editor IZM Fraunhoffer TU Berlin and OsramTanja Braun of IZM Fraunhoffer discussed “Fan-out and Panel level technology for Advanced LED Packaging.”The ongoing miniaturization in LED chip size and thickness down to 200 μm and below requires adapted chip handling and assembly. Innovative solutions are needed to electrically connect top and bottom contacts of the LED guaranteeing at the same time a sufficient overall thermal concept. Polymer based package solutions need to consider the aging/yellowing of the polymers on constant exposure to intense light. High volume and low cost solutions are required.A blue LED with an area of 1×1 mm² and a thickness of 120 μm was chosen for package development. The LED has one contact pad on the topside and needs an additional electrical connection to the backside. The overall concept for the SMD compatible single LED package is shown below.Package size was designed to 1.6×1.6 … [Read more...] about IFTLE 366 IWLPC Part 3; LED WLP & IMEC & Experi Hybrid Wafer Bonding